4. Semiconductor device manufacturing: process
  5. Packaging or treatment of packaged semiconductor
  6. Assembly of plural semiconductive substrates each possessing...

Charles Gerard Woychik

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CTE compensated chip interposer

Electricity: conductors and insulators – Conduits – cables or conductors – Preformed panel circuit arrangement
Reexamination Certificate

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Floating interposer

Electricity: conductors and insulators – Conduits – cables or conductors – Preformed panel circuit arrangement
Reexamination Certificate

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High density integrated circuit packaging with chip stacking and

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Of specified configuration
Patent

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High density integrated circuit packaging with chip stacking...

Semiconductor device manufacturing: process – Coating with electrically or thermally conductive material – To form ohmic contact to semiconductive material
Reexamination Certificate

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High density integrated circuit packaging with chip stacking...

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Of specified configuration
Reexamination Certificate

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Profile ID: LFUS-PAI-P-467349

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