Low temperature controlled collapse chip attach process

Details Low temperature controlled collapse chip attach process Low temperature controlled collapse chip attach process

1990-11-05

1991-12-31

Arbes, Carl J.

Metal working

Method of mechanical manufacture

Electrical device making

2281802, H05K 334

Patent

active

050759655

ABSTRACT:
A controlled collapse chip connect method of joining an IC chip to a microelectronic circuit card. According to the method an inhomogeneous, anisotropic column of solder is deposited from a Pb/Sn alloy onto solder wettable I/O terminals of the I/C chip, without subsequent homogenizing reflow. The solder core has a Pb rich core and an Sn rich cap. The matching footprint of the solder wettable I/O terminals on the microelectronic circuit card is substantially free of deposited solder and presents a protected Cu surface to the solder columns, or, at most a surface of Cu and anti-oxidant. The chip is aligned with the corresponding footprints on the microelectronic circuit card, and the solder is reflowed to bond the chip to the microelectronic circuit card.

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IBM J. Research Devel., May 1969, pp. 226-238, by P. A. Totta et al.
IBM Technical Discl Bull., vol. 29, No. 11, Apr. 1987, pp. 4736-4737.
IBM Technical Discl Bull., vol. 30, No. 11, Apr. 1988, pp. 475-477.
"Joining Materials and Processes in Electronic Packaging", Principles of Electronic Packaging, 1988, pp. 577-619, Woychik & Senger.
"Chip to Package Interconnections"--Microelectronic Packaging Handbook, 1988, pp. 361-453, Koopman et al.

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