Copper interconnection structure incorporating a metal seed...

Details Copper interconnection structure incorporating a metal seed... Copper interconnection structure incorporating a metal seed...

2000-11-16

2002-06-04

Fourson, George (Department: 2823)

Semiconductor device manufacturing: process

Coating with electrically or thermally conductive material

To form ohmic contact to semiconductive material

C438S658000, C438S633000

Reexamination Certificate

active

06399496

ABSTRACT:

FIELD OF THE INVENTION
The present invention generally relates to an interconnection structure for providing electrical communication with an electronic device, and method for fabricating such structure and more particularly, relates to an interconnection structure for providing electrical connections to an electronic device by the incorporation of a copper alloy seed layer sandwiched in between a copper conductor body and an electronic device for improving the electromigration resistance, the adhesion and the surface properties of the interconnection structure.
BACKGROUND OF THE INVENTION
The technology of making interconnections to provide for vias, lines and other recesses in semiconductor chip structures, flat panel displays, and package applications has been developed for many years. For instance, in developing interconnection technology for very-large-scale-integrated (VLSI) structures, aluminum has been utilized as the primary metal source for contacts and interconnects in semiconductor regions or devices located on a single substrate. Aluminum has been the material of choice because of its low cost, good ohmic contact and high conductivity. However, pure aluminum thin-film conductors have undesirable properties such as a low melting point which limits its use to low temperature processing, possible diffusion into the silicon during annealing which leads to contact and junction failure, and electromigration. Consequently, a number of aluminum alloys have been developed which provided advances over pure aluminum. For instance, U.S. Pat. No. 4,566,177 discloses a conductive layer of an alloy of aluminum containing up to 3% by weight of silicon, copper, nickel, chromium and manganese was developed to improve electromigration resistance. U.S. Pat. No. 3,631,304 discloses aluminum alloys with aluminum oxide which were also used to improve electromigration resistance.
Recently developed ULSI technology has placed more stringent demands on the wiring requirements due to the extremely high circuit densities and faster operating speeds required of such devices. This leads to higher current densities in increasingly smaller conductor lines. As a result, higher conductance wiring is desired which requires either larger cross-section wires for aluminum alloy conductors or a different wiring material that has a higher conductance. The obvious choice in the industry is to develop the latter using pure copper for its desirable high conductivity.
In the formation of ULSI interconnection structures such as vias and lines, copper can be deposited into such recesses to interconnect semiconductor regions or devices located on the same substrate. However, copper is known to have problems at semiconductor device junctions due to its low electromigration resistance. The electromigration phenomenon occurs when the superposition of an electric field onto random thermal diffusion in a metallic solid causes a net drift of ions in the direction of the electron flow. Any diffusion of copper ions into the silicon substrate can cause device failure. In addition, pure copper does not adhere well to oxygen containing dielectrics such as silicon dioxide and polyimide. To fully utilize copper in interconnection technology, the adhesion properties of copper must also be improved.
U.S. Pat. No. 5,130,274, assigned to the common assignee of the present invention, discloses the use of a copper alloy containing an alloying element of less than 2 atomic % by first depositing an alloy into the recess of an interconnection structure and then forming a copper alloy plug and a thin layer of an oxide of the alloying element on the exposed surface of the plug. However, the technique still does not satisfy the more stringent requirements in ULSI structures where critical dimensions of less than 0.5 &mgr;m place a considerable burden on thin film chip interconnections. The use of standard Al (Cu) alloy and a silicon dioxide dielectric in a deep-submicron logic circuit wiring structure results in a large circuit delay caused mainly by the wiring connections.
The use of Cu as an alternative material to Al (Cu) in ULSI wiring structures to increase the chip speed has been attempted by others. However, numerous problems are incurred in Cu interconnections such as the tendency of Cu to corrode and the fast surface diffusion rates of copper in thin films. It is known that pure Cu has a smaller electromigration activation energy, i.e., 0.5~0.8 eV, than that in Al (Cu) of 0.8~0.9 eV. This implies that the advantage of using Cu for reducing interconnection electromigration failure at chip operating conditions is largely compromised.
A schematic of an enlarged, cross-sectional view of an electronic structure that utilizes conventional interconnections made of copper alloy is shown in FIG.
1
. The electronic structure
10
contains two levels of copper interconnections
12
,
16
and one stud level
14
illustrating a copper wiring structure by a Damascene process on a pre-fabricated device
20
. The device
20
is built on a semi-conducting substrate
24
. As shown in
FIG. 1
, a typical Damascene level is first fabricated by the deposition of a planar dielectric stack
26
. The dielectric stack
26
is then patterned and etched using standard lithographic and dry etch techniques to produce a desired wiring or via pattern. The process is then followed by the metal depositions of a thin adhesion/diffusion liner
18
and copper alloy metallurgy
12
wherein a bottom silicon nitride layer
28
is used as a diffusion barrier that is previously deposited on top of the device
20
to protect against copper diffusion. After the copper alloy interconnection
12
is formed, a top silicon nitride layer
32
is deposited as an etch stop layer for defining the next level copper interconnection
14
. After a second level dielectric stack
34
is deposited, a recess for an interconnect is etched into the dielectric layer
34
and the silicon nitride layer
32
.
An interlevel copper alloy stud
14
with liner
22
is then deposited by a technique similar to that used in depositing the first level copper alloy interconnection
12
. A variety of metal deposition techniques can be used for filling the trench or via. These techniques include a collimated sputtering process, an ion cluster beam process, an electron cyclotron resonance process, a chemical vapor deposition process, an electroless plating process and an electrolytic plating process. Other techniques such as a co-deposition method in which copper and an alloying element are co-deposited can also be used in forming the copper alloys. For instance, such co-deposition methods include co-sputtering, coplating, co-chemical vapor deposition and co-evaporation. After the completion of the interlevel copper alloy stud
14
, another similar process is repeated to form the second level copper interconnection
16
with liner
24
in a third dielectric stack layer
38
. An etch stop layer
36
of silicon nitride is utilized between the stud and the second level interconnections. Finally, a top silicon nitride layer
42
is deposited on top of the copper wiring structure
10
for protecting the device from the environment.
Other workers have attempted to use copper aIloys in providing enhanced electromigration resistance. For instance, U.S. Pat. No. 5,023,698 teaches copper alloys containing at least one alloying element selected from the group of Al, Be, Cr, Fe, Mg, Ni, Si, Sn and Zn. U.S. Pat. No. 5,077,005 teaches copper alloys containing at least one member selected from In, Cd, Sb, Bi, Ti, Ag, Sn, Pb, Zr and Hf where the weight percent of the alloying element used is between 0.0003 to 0.01. The copper alloys are used in TAB processes and as print circuit board members. U.S. Pat. No. 5,004,520 also teaches copper foil for film carrier application containing at least one alloying element selected from P, Al, Cd, Fe, Mg, Ni, Sn, Ag, Hf, Zn, B, As, Co, In, Mn, Si, Te, Cr and Zn with the alloying element concentrations from 0.03 to 0.5 weight percent. The alloys are used as connecting leads in i

Affiliated with

Also associated with

Rating

Copper interconnection structure incorporating a metal seed... does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Copper interconnection structure incorporating a metal seed..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Copper interconnection structure incorporating a metal seed... will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-2973208