4. Active solid-state devices (e.g., transistors, solid-state diode
  5. Combined with electrical contact or lead
  6. Wire contact, lead, or bond

Changsheng Chen

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active

Electronic component package with posts on the active side of th

Semiconductor device manufacturing: process – Coating with electrically or thermally conductive material – To form ohmic contact to semiconductive material
Patent

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Integrated passive components and package with posts

Electrical resistors – With base extending along resistance element – Resistance element coated on base
Reexamination Certificate

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Integrated passive components and package with posts

Inductor devices – Coil or coil turn supports or spacers – Printed circuit-type coil
Reexamination Certificate

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Integrated passive components and package with posts

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Bump leads
Reexamination Certificate

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Integrated passive components and package with posts

Electricity: electrical systems and devices – Electrostatic capacitors – Fixed capacitor
Reexamination Certificate

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Profile ID: LFUS-PAI-P-1614365

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