Integrated passive components and package with posts

Details Integrated passive components and package with posts Integrated passive components and package with posts

2005-09-20

2005-09-20

Hu, Shouxiang (Department: 2811)

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

Bump leads

C257S735000, C257S778000, C257S792000

Reexamination Certificate

active

06946734

ABSTRACT:
A method and apparatus for an electronic component package of a passive component using wafer level processing;is provided. Posts are formed on the active side of the substrate of an electronic component. A conductive layer leads the contact areas of the electronic component to the tops of the posts. The conductive layer on the top of the posts acting as leads, attaching to traces on a printed circuit board.

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