Electronic component package with posts on the active side of th

Details Electronic component package with posts on the active side of th Electronic component package with posts on the active side of th

1997-05-13

2000-04-18

Picardat, Kevin M.

Semiconductor device manufacturing: process

Coating with electrically or thermally conductive material

To form ohmic contact to semiconductive material

438613, 438614, 257737, 257780, H01L 2144

Patent

active

060514892

ABSTRACT:
A method and apparatus for an electronic component package using wafer level processing is provided. Posts are formed on the active side of the substrate of an electronic component. A conductive layer leads the contact areas of the electronic component to the tops of the posts. The conductive layer on the top of the posts acting as leads, attaching to traces on a printed circuit board.

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