Electronic device package enclosed by pliant medium laterally co

Details Electronic device package enclosed by pliant medium laterally co Electronic device package enclosed by pliant medium laterally co

1995-12-05

1998-06-16

Kincaid, Kristine L.

Electricity: conductors and insulators

Boxes and housings

Hermetic sealed envelope type

361760, H01L 2302

Patent

active

057674477

ABSTRACT:
The bottom and side surfaces of an electronic device, such as an integrated circuit chip or a multichip assembly, are surrounded by a soft gel medium. The gel medium is laterally confined by a rigid plastic rim that is epoxy-bonded in place along its perimeter. A plate, made of plastic or metal, can be attached to the top surface of the rim, in order to provide a cover for the package.

REFERENCES:
patent: 4546412 (1985-10-01), Nakazawa et al.
patent: 5423119 (1995-06-01), Yang
patent: 5455386 (1995-10-01), Brathwaite et al.
patent: 5473512 (1995-12-01), Degani et al.

Affiliated with

Also associated with

Rating

Electronic device package enclosed by pliant medium laterally co does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Electronic device package enclosed by pliant medium laterally co, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Electronic device package enclosed by pliant medium laterally co will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-1728357