4. Active solid-state devices (e.g., transistors, solid-state diode
  5. Combined with electrical contact or lead
  6. Of specified material other than unalloyed aluminum

Bor-Cheng Chen

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Early response to plasma/charging damage by special pattern...

Semiconductor device manufacturing: process – With measuring or testing – Electrical characteristic sensed
Reexamination Certificate

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Early response to plasma/charging damage by special pattern...

Semiconductor device manufacturing: process – With measuring or testing – Electrical characteristic sensed
Reexamination Certificate

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Method for fabricating a stress buffered bond pad

Semiconductor device manufacturing: process – Coating with electrically or thermally conductive material – To form ohmic contact to semiconductive material
Reexamination Certificate

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Multiple focal plane image comparison for defect detection and c

Optics: measuring and testing – By configuration comparison – With photosensitive film or plate
Patent

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Stress buffered bond pad and method of making

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Of specified material other than unalloyed aluminum
Patent

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Profile ID: LFUS-PAI-P-698072

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