4. Semiconductor device manufacturing: process
  5. Packaging or treatment of packaged semiconductor
  6. Including adhesive bonding step

Boon Pew Chan

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Double sided single inline memory module

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Smart card package
Patent

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Integrated circuit package

Electricity: conductors and insulators – Boxes and housings – Hermetic sealed envelope type
Reexamination Certificate

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Integrated circuit package and flat plate molding process...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead
Reexamination Certificate

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Method for adhering and sealing a silicon chip in an integrated

Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Including adhesive bonding step
Patent

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Method for adhering and sealing a silicon chip in an...

Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor
Reexamination Certificate

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Profile ID: LFUS-PAI-P-772113

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