4. Metal fusion bonding
  5. Process
  6. Using a compliant cushioning medium

Bethany J. Walles

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Method and adjustment for known good die testing using resilient

Electricity: measuring and testing – Fault detecting in electric circuits and of electric components – Of individual circuit component or element
Patent

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Method and apparatus for testing an integrated circuit using con

Electricity: measuring and testing – Measuring – testing – or sensing electricity – per se – With rotor
Patent

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Ultrasonic flip chip bonding process and apparatus

Metal fusion bonding – Process – Using a compliant cushioning medium
Patent

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Ultrasonic flip chip bonding process and apparatus

Metal fusion bonding – Means to apply vibratory solid-state bonding energy to work
Patent

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Ultrasonic flip chip process and apparatus

Metal fusion bonding – Process – Using high frequency vibratory energy
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Profile ID: LFUS-PAI-P-300786

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