Ultrasonic flip chip bonding process and apparatus

Details Ultrasonic flip chip bonding process and apparatus Ultrasonic flip chip bonding process and apparatus

1996-11-04

1997-09-23

Heinrich, Samuel M.

Metal fusion bonding

Means to apply vibratory solid-state bonding energy to work

228 55, B23K 2010, H01C 21607

Patent

active

056695454

ABSTRACT:
A process for bonding a flip chip (20), of the type having an active face provided with conductive bumps, to a substrate (22) so that its active face is oriented toward the substrate (22). The flip chip (20) is coupled through a vacuum to the distended end (32) of an ultrasonic horn (30) and then lowered onto the substrate (22) so that the bumps (20b) align with a bonding pattern on the substrate (22). A bias force is applied through the ultrasonic horn (30) to the backside of the flip chip (20), in a direction normal to the substrate (22) so that minimal lateral displacement of the flip chip (20) and the substrate (22) results. The ultrasonic horn (30) is then activated while the bias force is applied such that the ultrasonic energy is isothermally transferred in a direction normal to and across the flip chip (20) to the substrate (22) for creating a diffusion bond therebetween.

REFERENCES:
patent: 3563443 (1971-02-01), Pedrotti et al.
patent: 4411721 (1983-10-01), Wishart
patent: 5341979 (1994-08-01), Gupta
patent: 5591298 (1997-01-01), Goodman et al.

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