Metal fusion bonding – Process – Using high frequency vibratory energy
Patent
1994-05-06
1995-06-27
Heinrich, Samuel M.
Metal fusion bonding
Process
Using high frequency vibratory energy
22818022, H01L 21607
Patent
active
054273013
ABSTRACT:
A process for bonding a flip chip (20) to a substrate (22) comprising positioning the flip chip (20) above the substrate (22). The flip chip (20) has an active face provided with conductive bumps so that its active face is oriented toward the substrate (22). The flip chip (20) is placed on the substrate (22) so that the bumps align with a bonding pattern on the substrate (22). An ultrasonic horn (30) is lowered having a flat surface onto a back side of the flip chip (20). Force is applied through the ultrasonic horn (30) to the back side of the flip chip (20), which is normal to the substrate (22) so that minimal lateral displacement of the flip chip (20) and the substrate (22) results. The ultrasonic horn (30) is then activated while the force is applied so that the ultrasonic energy is isothermally transferred across the flip chip (20) to the substrate (22) and a diffusion bond is created therebetween.
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patent: 5250843 (1993-10-01), Eichelberger
patent: 5341979 (1994-08-01), Gupta
patent: 5347086 (1994-09-01), Potter et al.
Hayden Brian J.
Pham Cuong V.
Walles Bethany J.
Dixon Richard D.
Ford Motor Company
Heinrich Samuel M.
May Roger L.
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