4. Pipe joints or couplings
  5. Essential catch

Bernd Goller

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Electronic component and process for producing the...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Multiple housings
Reexamination Certificate

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Electronic component with a plastic package and method for...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package
Reexamination Certificate

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Electronic component with at least one semiconductor chip...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead
Reexamination Certificate

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Electronic component with at least two stacked semiconductor...

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Chip mounted on chip
Reexamination Certificate

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Electronic device configured as a multichip module,...

Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor
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Profile ID: LFUS-PAI-P-1177882

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