Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead
Reexamination Certificate
2005-10-11
2005-10-11
Hu, Shouxiang (Department: 2811)
Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
With contact or lead
C257S692000, C257S666000
Reexamination Certificate
active
06953992
ABSTRACT:
The invention relates to an electronic component having at least one semiconductor chip and a flat chip carrier assigned to the semiconductor chip. Electrical connections between contact areas on an active chip surface of the semiconductor chip and contact terminal areas on an upper side of the chip carrier are formed by strips of material that can undergo microstructuring and that are provided with an electrically conductive coating. The invention also relates to a method for producing the electronic component.
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Goller Bernd
Hagen Robert-Christian
Ofner Gerald
Stümpfl Christian
Thumbs Josef
Greenberg Laurence A.
Hu Shouxiang
Infineon - Technologies AG
Mayback Gregory L.
Stemer Werner H.
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