4. Electricity: conductors and insulators
  5. Boxes and housings
  6. Hermetic sealed envelope type

Arthur Woodworth

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High current capacity semiconductor device package and lead...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead
Reexamination Certificate

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High current capacity semiconductor device package and lead...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead
Reexamination Certificate

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Lead frame with waffled front and rear surfaces

Electricity: conductors and insulators – Boxes and housings – Hermetic sealed envelope type
Patent

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Plural semiconductor die housed in common package with split hea

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With provision for cooling the housing or its contents
Patent

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Surface mount semiconductor package

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material
Patent

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Profile ID: LFUS-PAI-P-434407

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