Lead frame with waffled front and rear surfaces

Details Lead frame with waffled front and rear surfaces Lead frame with waffled front and rear surfaces

1997-06-11

1999-05-11

Kincaid, Kristine

Electricity: conductors and insulators

Boxes and housings

Hermetic sealed envelope type

257713, 257675, 257676, H01L23/02

Patent

active

059029595

ABSTRACT:
A surface mount semiconductor package includes a semiconductor device, a metal pad on which the semiconductor device is mounted, and a housing formed of a flowable material which bonds to the metal pad and encapsulates the semiconductor device when cured, where the metal pad includes a waffled surface opposite the surface on which the semiconductor device is mounted for accepting solder between the metal pad and a substrate and for permitting solder wetting therebetween.

REFERENCES:
patent: 5214307 (1993-05-01), Davis
patent: 5255157 (1993-10-01), Hegel
patent: 5278446 (1994-01-01), Nagaraj et al.
patent: 5397915 (1995-03-01), Nose
patent: 5430331 (1995-07-01), Hamzehdoost et al.
patent: 5637925 (1997-06-01), Ludden et al.
patent: 5659199 (1997-08-01), Mori et al.

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