4. Active solid-state devices (e.g., transistors, solid-state diode
  5. Housing or package
  6. With provision for cooling the housing or its contents

Arndt Lüdtke

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Heat sink formed of diamond-containing composite material...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With provision for cooling the housing or its contents
Reexamination Certificate

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Package with a substrate of high thermal conductivity

Stock material or miscellaneous articles – All metal or with adjacent metals – Having composition – density – or hardness gradient
Reexamination Certificate

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Profile ID: LFUS-PAI-P-2801994

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