Package with a substrate of high thermal conductivity

Details Package with a substrate of high thermal conductivity Package with a substrate of high thermal conductivity

2006-02-14

2006-02-14

McNeil, Jennifer (Department: 1775)

Stock material or miscellaneous articles

All metal or with adjacent metals

Having composition, density, or hardness gradient

C428S602000, C428S620000, C428S621000, C428S686000, C438S122000, C438S124000, C438S127000

Reexamination Certificate

active

06998180

ABSTRACT:
A package is configured as a composite component with a substrate, at least one semiconductor component, and an enclosure, which are joined to one another. The heat-dissipating substrate is a single-layer or multilayer substrate with a thermal conductivity, transversely with respect to a joining surface to which the semiconductor component is joined, of greater than 170 W/m. The substrate may be a layered structure and/or a structure of graduated material composition, and it has an asymmetrical thermal expansion characteristic. By suitable selection the layers or the material graduation, it is possible to reduce and limit the shear distortion of the composite component formed of the substrate, the semiconductor component, and the enclosure.

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Robert M. Jones: “Mechanics of Composite Materials”,Hemisphere Publishing Corporation, New York, 1975, pp. 154-155.

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