4. Semiconductor device manufacturing: process
  5. Bonding of plural semiconductor substrates
  6. Thinning of semiconductor substrate

Arjun Kar-Roy

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Deep N wells in triple well structures and method for...

Semiconductor device manufacturing: process – Forming bipolar transistor by formation or alteration of... – Self-aligned
Reexamination Certificate

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Fabricating a top conductive layer in a semiconductor die

Semiconductor device manufacturing: process – Bonding of plural semiconductor substrates – Thinning of semiconductor substrate
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High density composite MIM capacitor with flexible routing...

Active solid-state devices (e.g. – transistors – solid-state diode – Integrated circuit structure with electrically isolated... – Passive components in ics
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High density composite MIM capacitor with reduced voltage...

Active solid-state devices (e.g. – transistors – solid-state diode – Integrated circuit structure with electrically isolated... – Passive components in ics
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High density metal insulator metal capacitors

Electricity: electrical systems and devices – Electrostatic capacitors – Fixed capacitor
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Profile ID: LFUS-PAI-P-2266310

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