4. Electricity: measuring and testing
  5. Fault detecting in electric circuits and of electric components
  6. Of individual circuit component or element

Apack Technologies Inc.

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Flip clip bonding leadframe-type packaging method for...

Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor
Reexamination Certificate

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Method for improving the reliability of underfill process...

Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor
Reexamination Certificate

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Semiconductor package with a stacked chip on a leadframe

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – On insulating carrier other than a printed circuit board
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Solder screen printing process

Printing – Stenciling – Processes
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Testing device and method for known good chip

Electricity: measuring and testing – Fault detecting in electric circuits and of electric components – Of individual circuit component or element
Reexamination Certificate

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