Active solid-state devices (e.g., transistors, solid-state diode
Combined with electrical contact or lead
Bump leads
Inventor
active
Apparatus and method for automating the underfill of flip-chip d
Apparatus and method for automating the underfill of...
Apparatus and method for detecting the height above a silicon su
Apparatus for testing a plurality of integrated circuits in para
Ball contact for flip-chip device
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Profile ID: LFUS-PAI-P-182309