Apparatus and method for automating the underfill of flip-chip d

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Bump leads

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257778, 257787, H01L 2348

Patent

active

059427981

ABSTRACT:
An apparatus and method for underfilling a silicon chip (16) to a substrate (12) by depositing an underfill dam (18) on the surface (20) of the substrate (12) prior to addition of the underfill material (14), is disclosed. A bead of underfill material (14) is provided on the substrate (12) about the periphery of the silicon chip (16), within the underfill dam (18). The underfill material (14) fills the gap (22) between the electrical contacts, the substrate (12) and the silicon chip (16) by capillary action and differential pressure created by a vacuum system (40).

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