Ball contact for flip-chip device

Details Ball contact for flip-chip device Ball contact for flip-chip device

1994-02-22

1999-09-21

Arroyo, Teresa M.

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

Bump leads

257738, 257780, 257786, 257778, H01L 2348, H01L 2352

Patent

active

059557842

ABSTRACT:
A contact for a semiconductor device or passive substrate is made up of an array of conductive balls, the individual balls of the contact being a compressible material coated with a metal conductive material. The balls in the array are compressed while being bonded to the contact area to provide a larger bond area between the ball and the contact area to which it is bonded.

REFERENCES:
patent: 2934685 (1960-04-01), Jones
patent: 3809625 (1974-05-01), Brown et al.
patent: 3871014 (1975-03-01), King et al.
patent: 4369458 (1983-01-01), Thomas et al.
patent: 4600600 (1986-07-01), Pammer et al.
patent: 4838347 (1989-06-01), Dentini et al.
patent: 5001542 (1991-03-01), Tsukagosh et al.
patent: 5010038 (1991-04-01), Fox et al.
patent: 5207585 (1993-05-01), Byrnes et al.

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