4. Electricity: electrical systems and devices
  5. Housing or mounting assemblies with diverse electrical...
  6. For electronic systems and devices

Andrew C. Ross

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CSP stacking technology using rigid/flex construction

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead
Reexamination Certificate

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Panel stacking of BGA devices to form three-dimensional modules

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Multiple housings
Reexamination Certificate

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Panel stacking of BGA devices to form three-dimensional modules

Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Assembly of plural semiconductive substrates each possessing...
Reexamination Certificate

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Universal package and method of forming the same

Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices
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Universal package and method of forming the same

Metal working – Method of mechanical manufacture – Electrical device making
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Profile ID: LFUS-PAI-P-2105240

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