Akira Shintai

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Conductor composition, a mounting substrate and a mounting...

Compositions – Electrically conductive or emissive compositions – Free metal containing
Reexamination Certificate

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Conductor composition, a mounting substrate and a mounting...

Compositions – Electrically conductive or emissive compositions – Free metal containing
Reexamination Certificate

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Electronic package encapsulating electronic components therein

Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices
Reexamination Certificate

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Epoxy resin composition and cured product thereof

Synthetic resins or natural rubbers -- part of the class 520 ser – Synthetic resins – Processes of preparing a desired or intentional composition...
Patent

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Manufacturing method for a resin sealed semiconductor device

Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Making plural separate devices
Patent

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Profile ID: LFUS-PAI-P-672233

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