Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Making plural separate devices
Patent
1997-12-16
1999-07-06
Picardat, Kevin M.
Semiconductor device manufacturing: process
Packaging or treatment of packaged semiconductor
Making plural separate devices
438127, H01L 2144
Patent
active
059207680
ABSTRACT:
A hybrid IC substrate and a power transistor are mounted on a mounting base so as to form a lead frame assembly. The hybrid IC substrate and the power transistor are electrically connected by wires. The lead frame assembly is held between upper and lower molding dies. Inner leads are arranged in a vicinity of an air vent communicating with a molding cavity defined between the upper and lower molding dies so as to protrude into the molding cavity. A liquefied molding resin is injected into the molding cavity from a gate at an upstream side of the molding cavity opposed to the inner leads. The injected molding resin is separated into upper and lower resin flows advancing above and below the lead frame assembly. Then, either of the upper and lower resin flows reaches a downstream side of the molding cavity and merges into the other resin flow after passing through clearances between the inner leads at a reduced speed decelerated by the inner leads, thereby filing the molding cavity with the molding resin without causing any void.
REFERENCES:
patent: 5018003 (1991-05-01), Yasunaga et al.
patent: 5672550 (1997-09-01), Tsugi et al.
patent: 5733802 (1998-03-01), Inoue et al.
patent: 5750423 (1998-05-01), Ishii
Denso Corporation
Picardat Kevin M.
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