Compositions – Electrically conductive or emissive compositions – Free metal containing
Reexamination Certificate
2007-05-17
2010-10-05
Silverman, Stanley (Department: 1793)
Compositions
Electrically conductive or emissive compositions
Free metal containing
C252S500000, C428S357000, C428S402000, C428S403000, C228S180100, C228S188000, C228S262100, C427S096100, C427S123000, C427S125000, C156S247000, C156S253000, C029S843000, C029S846000, C174S256000, C174S257000
Reexamination Certificate
active
07807073
ABSTRACT:
A conductor composition being able to easily secure the conductivity at the same level as an Ag bulk at low temperature process, a mounting substrate utilizing the conductor composition and a mounting structure utilizing the conductor composition are provided. In a mounting structure, wherein one or more electrodes (11) of a mounting substrate (10) and one or more surface mounting components (20) are connected through a conductor composition (30), and one or more surface wirings (14) of the mounting substrate (10), one or more inner-layer wirings (13) and one or more via conductors (12) are formed with the conductor composition, the conductor composition contains conductive particles with electrical conductivity, and the conductive particles are composed of low crystallized Ag fillers with the crystal size of 10 μm or less.
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Notice of Reasons for Rejection mailed Dec. 18, 2007 in corresponding Japanese Patent Application No. 2003-362291 (and English translation).
Imai Hirokazu
Ootani Yuji
Shintai Akira
Totokawa Masashi
DENSO CORPORATION
Posz Law Group , PLC
Silverman Stanley
Vijayakumar Kallambella
LandOfFree
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