Electronic package encapsulating electronic components therein

Details Electronic package encapsulating electronic components therein Electronic package encapsulating electronic components therein

2007-07-17

2010-02-23

Lee, Jinhee J (Department: 2841)

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

C361S760000

Reexamination Certificate

active

07667978

ABSTRACT:
An electronic component unit including a metallic member and an electronic component, such as a semiconductor element, mounted on the metallic member is encapsulated with molding resin such as epoxy resin, thereby forming an electronic package. The electronic component unit is covered with primer made of a material such as resin to increase an adhesive force of the molding resin to the electronic component unit. A glass transition temperature of both of the molding resin and the primer is set to a temperature higher than 200° C. to keep the adhesive force unchanged at least up to the ambient temperature of 200° C. and to secure a reliability of the electronic package. A metallic lead wire connected to the electronic component may be encapsulated together with the electronic component unit. An entire surface of the electronic component unit may be covered with the primer to further improve the adhesive force.

REFERENCES:
patent: 5353498 (1994-10-01), Fillion et al.
patent: 5866952 (1999-02-01), Wojnarowski et al.
patent: 6046072 (2000-04-01), Matsuura et al.
patent: 6147374 (2000-11-01), Tanaka et al.
patent: 6248613 (2001-06-01), Matsuura et al.
patent: 6372080 (2002-04-01), Matsuura et al.
patent: 6441416 (2002-08-01), Tanaka et al.
patent: 6465827 (2002-10-01), Tanaka et al.
patent: 6525359 (2003-02-01), Tanaka et al.
patent: 6558791 (2003-05-01), Matsuura et al.
patent: 6617630 (2003-09-01), Tanaka et al.
patent: 6657245 (2003-12-01), Tanaka et al.
patent: 6847125 (2005-01-01), Tanaka et al.
patent: 7064368 (2006-06-01), Tanaka et al.
patent: 2005/0248014 (2005-11-01), Tanaka et al.
patent: 2006/0080348 (2006-04-01), Cesana et al.
patent: 2006/0199923 (2006-09-01), Akiba et al.
patent: 2006/0216520 (2006-09-01), Osada
patent: 2007/0145547 (2007-06-01), McKerreghan et al.
patent: A-2000-200864 (2000-07-01), None
Office Action dated Jan. 21, 2009 in corresponding German patent application No. 10 2007 032 074.6-33 (and English translation).

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