Akira Karashima

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Lead frame

Patent

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Method of manufacturing a semiconductor chip comprising...

Semiconductor device manufacturing: process – Coating with electrically or thermally conductive material – To form ohmic contact to semiconductive material
Reexamination Certificate

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Rigidized lead frame for a semiconductor device

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With stress relief
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Semiconductor device

Active solid-state devices (e.g. – transistors – solid-state diode – Encapsulated
Reexamination Certificate

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Semiconductor device and its manufacturing method

Active solid-state devices (e.g. – transistors – solid-state diode – Responsive to non-electrical signal – Electromagnetic or particle radiation
Reexamination Certificate

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Profile ID: LFUS-PAI-P-354020

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