Rigidized lead frame for a semiconductor device

Details Rigidized lead frame for a semiconductor device Rigidized lead frame for a semiconductor device

1996-11-27

1999-07-06

Williams, Alexander Oscar

Active solid-state devices (e.g., transistors, solid-state diode

Lead frame

With stress relief

257666, 257672, 257674, 257692, 257696, 257698, H01L 23495, H01L 2328, H01L 2350

Patent

active

059201169

ABSTRACT:
In semiconductor device fabrication, warping of the support pins must be prevented so that the semiconductor element can be properly positioned during the wire-bonding and resin-sealing processes. The invention provides a process in which a V-shaped groove 33, for example, is formed in the mounting pad 31 and the support pins 32, imparting rigidity to the support pins 32.

REFERENCES:
patent: 4797726 (1989-01-01), Manube
patent: 4942452 (1990-07-01), Kitano et al.
patent: 5175610 (1992-12-01), Kobayashi
patent: 5214307 (1993-05-01), Davis
patent: 5397915 (1995-03-01), Nose
patent: 5578871 (1996-11-01), Fierkens
patent: 5623123 (1997-04-01), Umehara
patent: 5637913 (1997-06-01), Kajihara et al.

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