4. Semiconductor device manufacturing: process
  5. Coating with electrically or thermally conductive material
  6. To form ohmic contact to semiconductive material

Akinobu Teramoto

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Bonding apparatus and wire bonding method

Metal fusion bonding – Process – Plural joints
Reexamination Certificate

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Electronic device identifying method

Electricity: measuring and testing – Measuring – testing – or sensing electricity – per se – With rotor
Reexamination Certificate

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Inverter unit, integrated circuit chip, and vehicle drive...

Electricity: motive power systems – Induction motor systems – Primary circuit control
Reexamination Certificate

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Method and apparatus for managing manufacturing equipment,...

Data processing: generic control systems or specific application – Generic control system – apparatus or process – Sequential or selective
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Method for manufacturing semiconductor device and method for...

Semiconductor device manufacturing: process – Chemical etching – Having liquid and vapor etching steps
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Profile ID: LFUS-PAI-P-2012017

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