4. Stock material or miscellaneous articles
  5. Structurally defined web or sheet
  6. Discontinuous or differential coating, impregnation or bond

Akimori Hayashi

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Package substrate for a semiconductor device having...

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Flip chip
Reexamination Certificate

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Package substrate for a semiconductor device having...

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Flip chip
Reexamination Certificate

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Printed circuit board having colored outer layer

Stock material or miscellaneous articles – Structurally defined web or sheet – Discontinuous or differential coating – impregnation or bond
Reexamination Certificate

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Printed circuit board having colored outer layer

Stock material or miscellaneous articles – Structurally defined web or sheet – Discontinuous or differential coating – impregnation or bond
Reexamination Certificate

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Wiring board

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Configuration or pattern of bonds
Reexamination Certificate

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Profile ID: LFUS-PAI-P-2349706

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