Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
With contact or lead
Inventor
active
Ball grid substrate for lead-on-chip semiconductor package
Ball grid substrate for lead-on-chip semiconductor package
Electrical circuit and method of formation
Method for making a substrate for an integrated circuit package
Packed system of semiconductor chips having a semiconductor...
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Profile ID: LFUS-PAI-P-813318