Chip sized package

Details Chip sized package Chip sized package

1998-04-29

2000-04-25

Clark, Sheila V.

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

Ball or nail head type contact, lead, or bond

257783, H01L 2348, H01L 2352, H01L 2940

Patent

active

060547723

ABSTRACT:
An improved wafer based packaging arrangement for integrated circuits is disclosed. In one aspect of the invention, external contacts are formed for the packaged integrated circuits by contact studs formed from bonding wires. One end of each contact studs is ball bonded to an associated wafer bond pad. An elongated portion of each wire (contact stud) extends outward the wafer surface and terminates at a second end that forms an external contact. Filling material surrounds a significant portion of the contact studs to hold the studs in place but leaves at least a portion of the second ends exposed to form external contacts. In some embodiments, the external contacts are substantially coplanar with the surface of the filling material, while in others, a protrusion beyond the filling material surface is left to form a contact bump. The wafers are eventually diced to form discrete packaged integrated circuits having external contacts formed by the contact studs.

REFERENCES:
patent: 5159434 (1992-10-01), Kohno et al.
patent: 5373190 (1994-12-01), Ichiyama
patent: 5496775 (1996-03-01), Brooks
patent: 5554887 (1996-09-01), Sawai et al.
patent: 5650667 (1997-07-01), Liou
patent: 5777385 (1998-07-01), Wu

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