Method of improving interconnect of semiconductor devices by usi

Details Method of improving interconnect of semiconductor devices by usi Method of improving interconnect of semiconductor devices by usi

1999-09-07

2000-12-26

Whitehead, Jr., Carl

Semiconductor device manufacturing: process

Coating with electrically or thermally conductive material

To form ohmic contact to semiconductive material

438123, 438617, H01L 2144

Patent

active

061658871

ABSTRACT:
A method of forming a semiconductor device assembly comprising forming a wire bump on at least one bond pad on the active surface of a semiconductor device and connecting one end of a wire to the wire bump using a wire bond. The wire bump may be flattened before connecting one end of a wire thereto.

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