Ceramic package for memory semiconductor

Details Ceramic package for memory semiconductor Ceramic package for memory semiconductor

1992-07-20

1993-10-26

Hille, Rolf

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

With window means

257681, 257704, 257710, 361390, 361421, 361820, 361807, 174 524, H01L 3902, H01L 2328, H01L 2302

Patent

active

052569012

ABSTRACT:
A ceramic package for a memory semiconductor accommodates therein the memory semiconductor and is sealingly closed by an ultraviolet ray transmissible ceramic lid. The ceramic lid is made of a polycrystalline alumina and formed with at least one groove in a sealing portion with the ceramic package. With the arrangement, the ceramic package is superior in sealing strength, air-tightness and ultraviolet ray transmission and can easily accommodate any increase of memory amount of semiconductor elements.

REFERENCES:
patent: 4629824 (1986-12-01), Gilder, Jr., et al.
`Cap with grooved seal band . . . `, IBM Tech. Dis. Bull., vol. 28, No. 6, Nov. 1985 pp. 2699-2700.
JP-A-62-106 653, Patent Abstracts of Japan, vol. 11, No. 314 Oct. 13, 1987.
JP-A-60-21 544, Patent Abstracts of Japan, vol. 9, No. 140, Jun. 14, 1985.
JP-A-61-194 751, Patent Abstracts of Japan, vol. 11, No. 23, Jan. 22, 1987.
JP-A-62-98 649, Patent Abstracts of Japan, vol. 11, No. 306, Oct. 6, 1987.
JP-A-61-294 842, Patent Abstracts of Japan, vol. 11, No. 161, May 23, 1987.
JP-A-62-37 949, Patent Abstracts of Japan, vol. 11, No. 217, Jul. 14, 1987.
IBM Technical Disclosure Bulletin vol. 29, No. 7, Dec., 1986, pp. 3085-3087.

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