Fabrication of bipolar/CMOS integrated circuits and of a capacit

Semiconductor device manufacturing: process – Making field effect device having pair of active regions... – Having insulated gate

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438234, 438344, 438345, 438349, 438350, 438367, 438368, 438370, 438375, 438482, 438491, 438545, 438548, 438564, H01L 218238

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061565946

ABSTRACT:
The present invention relates to a method for fabricating an integrated circuit including MOS transistors and a bipolar transistor of NPN type, including the steps of: forming the MOS transistors, covering the entire structure with a protection layer, opening the protection layer at the base-emitter location of the bipolar transistor, forming a first P-type doped layer of polysilicon, a second layer of silicon nitride and a second oxide layer, opening these last three layers at the center of the emitter-base region of the bipolar transistor, and depositing a third silicon nitride layer, forming spacers, removing the apparent parts of the third layer of silicon nitride, and depositing a third N-type doped polysilicon layer.

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