Integral rigid chip test probe

Details Integral rigid chip test probe Integral rigid chip test probe

1996-11-08

1998-11-17

Ballato, Josie

Electricity: measuring and testing

Fault detecting in electric circuits and of electric components

Of individual circuit component or element

324761, G01R 3102

Patent

active

058381600

ABSTRACT:
The present invention is directed to probe structures for testing of electrical interconnections to integrated circuit devices and other electronic components and particularly to testing integrated circuit devices with high density area array solder ball interconnections. The probe structure is formed from a substrate having a surface having at least one electrical contact location which has a perimeter which is raised above the surface and a location within the boundaries of said perimeter which is raised above the surface.

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Moto'o Nakano, "A Probe for Testing Semiconductor Integrated Circuits and a Test Method Using Said Probe," 25 Mar. 1991, Japanese Patent Office Disclosure No. Hei 3-69131, Filing No. Hei 1-205301, Filing date 8 Aug. 1989.

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