4. Electrical connectors
  5. Including elastomeric or nonmetallic conductive portion
  6. Adapted to be sandwiched between preformed panel circuit...

Keith Edward Fogel

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Amorphization/templated recrystallization method for hybrid...

Semiconductor device manufacturing: process – Formation of electrically isolated lateral semiconductive... – Grooved and refilled with deposited dielectric material
Reexamination Certificate

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Amorphization/templated recrystallization method for hybrid...

Semiconductor device manufacturing: process – Formation of semiconductive active region on any substrate – Amorphous semiconductor
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Angled flying lead wire bonding process

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Wire contact – lead – or bond
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Angled flying lead wire bonding process

Metal working – Method of mechanical manufacture – Electrical device making
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Angled flying lead wire bonding process

Metal working – Method of mechanical manufacture – Electrical device making
Reexamination Certificate

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Profile ID: LFUS-PAI-P-47448

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