Method to form hemi-spherical grain (HSG) silicon

Semiconductor device manufacturing: process – Making field effect device having pair of active regions... – Having insulated gate

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438398, H01L 218242

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058375805

ABSTRACT:
An embodiment of the present invention develops a process for forming Hemi-Spherical Grained silicon by the steps of: forming amorphous silicon from a gas source comprising at least one of dichlorosilane, disilane or trisilane, wherein the amorphous silicon comprising at least one impurity doped amorphous portion, the amorphous silicon is deposited at a deposition temperature no greater than 525.degree. C.; and annealing the amorphous silicon for a sufficient amount of time and at an elevated annealing temperature, thereby transforming the amorphous silicon into the Hemi-Spherical Grained silicon.

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NEC Corp. forming HSG polysilicon layer, J. Appl. 71(7), 1 Apr. 1992, pp. 3538-3543.
Jun et al. The fabrication and electrical properties of Modulated Stacked capacitor, pp. 430-432, 1992 IEEE, Elecron Device letter vol. 13, No. 8.
"A new cylindrical capacitor using HSG Si for 256 Mb DRAMS" by Watanabe et al. IEDM. 1992, pp. 259-262 (No month).
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