Semiconductor lead frame

Details Semiconductor lead frame Semiconductor lead frame

1994-08-25

1999-12-14

Whitehead, Jr., Carl

Active solid-state devices (e.g., transistors, solid-state diode

Lead frame

257667, 257676, 257691, 257692, 257693, 257695, H01L 2348

Patent

active

060021640

ABSTRACT:
A lead frame having a plurality of metallic conductors with each conductor having a coined or stamped region near its proximal end but spaced therefrom to provide pressure points to assure substantial even joining of the conductor to semiconductor chip via an insulative adhesive medium. The lead frame, when mounted on the active face of a semiconductor chip, has wires connecting terminals on the major active surface of the semiconductor chip to the bands on selected lead frame conductors. The lead frame on the semiconductor chip and the wires which connect the semiconductor chip terminals to the bands of selected lead frame conductors are then encapsulated with a suitable insulative material to form a semiconductor module or package.

REFERENCES:
patent: 4711700 (1987-12-01), Cusack
patent: 4862245 (1989-08-01), Pashby et al.
patent: 5164815 (1992-11-01), Lim

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