4. Metal fusion bonding
  5. Process
  6. Metal to nonmetal with separate metallic filler

H. Ward Conru

Inventor

Rate now
  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

Inventor

active

Method of bonding gold or gold alloy wire to lead tin solder

Metal fusion bonding – Process – Metal to nonmetal with separate metallic filler
Patent

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Method of making a planarized thin film covered wire bonded semi

Fishing – trapping – and vermin destroying
Patent

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Planarized thin film surface covered wire bonded semiconductor p

Electricity: conductors and insulators – Boxes and housings – Hermetic sealed envelope type
Patent

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Semiconductor lead frame

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame
Patent

  [ 0.00 ] – not rated yet Voters 0   Comments 0

No associations

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

H. Ward Conru does not yet have a rating. At this time, there are no reviews or comments for this inventor.

If you have personal experience with H. Ward Conru, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and H. Ward Conru will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-P-109388

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.

Canada

 Charities
 Companies
 MP Candidates
 Patents
 Employee Salary Disclosure

World

 Places of the World
 Scientific Papers

United States

 Banks
 Companies
 Counties
 Patents
 Employee Salary Disclosure