Epoxy resin molding material for sealing of electronic component

Synthetic resins or natural rubbers -- part of the class 520 ser – Synthetic resins – Processes of preparing a desired or intentional composition...

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525476, 525487, 525523, C08G 5962

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active

053190050

ABSTRACT:
An epoxy resin molding material for sealing of electronic components comprising

REFERENCES:
patent: 4851481 (1989-07-01), Kuriyama et al.
patent: 4853434 (1989-08-01), Block
patent: 4904761 (1990-02-01), Okitsu et al.
patent: 4923912 (1990-05-01), Sasaki et al.
Abstract for Japan 3-197528.
World Patents Index Latest, Derwent Publications Ltd., London, GB; AN 90-271584(36) & JP-A-2 191 659 (Matsushita Elec. Works) Jul. 27, 1990.
World Patents Index Latest, Derwent Publications Ltd., London GB; AN 88-326860 & JP-A-63 241 021 (Hitachi Chemical Ltd.) Oct. 6, 1988.
Patent Abstracts of Japan, vol. 14, No. 377 (C-748)(4320) Aug. 15, 1990 & JP-A-2 138 332 (Ube Ind. Ltd.) May 28, 1990.
Patent Abstracts of Japan, vol. 14, No. 412 (C-755)(4355) Sep. 6, 1990 & JP-A-2 155 914 (Sumitomo Bakelite Co. Ltd.) Jun. 15, 1990.
IEEE Transactions on Components, Hybrids and Manufacturing Technology, vol. 7, No. 3, Sep. 1984, pp. 249-256; Otsuka et al; "A New Silicone Gel Sealing Mechanism for High Reliability Encapsulation" p. 255.

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