Plastic and nonmetallic article shaping or treating: processes
Forming articles by uniting randomly associated particles
Stratified or layered articles
Inventor
active
Encapsulant of epoxy resin, curing agent, and secondary...
Epoxy resin molding for sealing electronic parts containing orga
Epoxy resin molding material for sealing of electronic component
Epoxy resin molding material for sealing use and...
Epoxy resin molding material for sealing use and...
No associations
LandOfFree
Shinsuke Hagiwara does not yet have a rating. At this time, there are no reviews or comments for this inventor.
If you have personal experience with Shinsuke Hagiwara, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Shinsuke Hagiwara will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-P-628840