Active solid-state devices (e.g., transistors, solid-state diode
Lead frame
With dam or vent for encapsulant
Inventor
active
Chip supporting substrate for semiconductor package,...
Epoxy resin molding material for sealing of electronic component
Foamed pad material for low-pressure compression molding
Substrate for holding a chip of semi-conductor package, semi-con
Substrate for holding a chip of semi-conductor package,...
No associations
LandOfFree
Shigeki Ichimura does not yet have a rating. At this time, there are no reviews or comments for this inventor.
If you have personal experience with Shigeki Ichimura, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Shigeki Ichimura will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-P-453946