Semiconductor die packages having lead support frame

Details Semiconductor die packages having lead support frame Semiconductor die packages having lead support frame

1992-07-09

1994-02-08

Hille, Rolf

Active solid-state devices (e.g., transistors, solid-state diode

Lead frame

Small lead frame for connecting a large lead frame to a...

257666, 437206, 29741, 29760, 361813, H01L 2348, H01L 2944, H01L 2952, H01L 2960

Patent

active

052851052

ABSTRACT:
A reusable transport and test tape which includes a plurality of insulated conductors adapted to receive and connect to the leads of the lead pack and to position the lead pack for reception of an integrated circuit for bonding of lead pack leads to the contact pads of the integrated circuit and to move the lead pack and integrated circuit into succeeding processing stations where the circuit is tested and packaged.

REFERENCES:
patent: 4329642 (1982-05-01), Luthi et al.
patent: 4411719 (1983-10-01), Lindberg
patent: 4736236 (1988-04-01), Butt
patent: 4763409 (1988-08-01), Takekawa et al.
patent: 4772936 (1988-09-01), Reding et al.
patent: 4859614 (1989-08-01), Sugahara et al.
patent: 5002895 (1991-03-01), LeParquier et al.
patent: 5023202 (1991-06-01), Long et al.

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