Method of making BiCMOS semiconductor device

Semiconductor device manufacturing: process – Making field effect device having pair of active regions... – Having insulated gate

Patent

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

257370, 438234, H01L 21265

Patent

active

056656157

ABSTRACT:
A BiCMOS semiconductor device comprising a substrate, a vertical bipolar transistor provided on the substrate and having a first conductive base terminal electrode formed in a portion of a first semiconductor film provided on the substrate, a second conductive semiconductor terminal electrode formed in a second semiconductor film provided through an insulating layer on the first semiconductor film, the first and second conductive electrodes being disposed such that portions thereof overlap each other, and an LDD (lightly doped drain)-type MOS transistor provided on the substrate and having a gate electrode formed in a portion of said first semiconductor film and a gate side wall formed on a side wall of said gate electrode, wherein the insulating layer is caused to exist selectively in a region in which the first and second conductive electrodes are overlapped, and constitutes at least a portion of the gate side wall.

REFERENCES:
patent: 4927776 (1990-05-01), Soejima
patent: 4960726 (1990-10-01), Lechaton et al.
patent: 4965220 (1990-10-01), Iwasaki
patent: 5059549 (1991-10-01), Furuhata
patent: 5196356 (1993-03-01), Won et al.
patent: 5409845 (1995-04-01), Robinson et al.
patent: 5439833 (1995-08-01), Hebert et al.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Method of making BiCMOS semiconductor device does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method of making BiCMOS semiconductor device, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method of making BiCMOS semiconductor device will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-69394

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.