Process for etching silicon nitride selectively to silicon oxide

Adhesive bonding and miscellaneous chemical manufacture – Delaminating processes adapted for specified product – Delaminating in preparation for post processing recycling step

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156653, 156657, 20419237, B44C 122, C03C 1500, C03C 2506

Patent

active

048203785

ABSTRACT:
A process for etching silicon nitride which is selective to silicon oxide with a vacuum processing module which has a remote plasma, which is generated form a gas including He and SF.sub.6, introduced to the wafer face.

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