Semiconductor device having doubled pads

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Configuration or pattern of bonds

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Details

257773, 257737, H01L 2348, H01L 2352, H01L 2940

Patent

active

059659483

ABSTRACT:
In a semiconductor device, a plurality of first pads are arranged in a row on a semiconductor chip, and a plurality of second pads are arranged in another row on the semiconductor chip. One of the first pads and one of the second pads is capable of receiving the same signal.

REFERENCES:
patent: 5194931 (1993-03-01), Araki
patent: 5442241 (1995-08-01), Tane
patent: 5587607 (1996-12-01), Yasuda et al.

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