Process for forming solder balls on a plate having apertures usi

Details Process for forming solder balls on a plate having apertures usi Process for forming solder balls on a plate having apertures usi

1995-10-24

1997-07-01

Graybill, David E.

Fishing, trapping, and vermin destroying

437228BO, 228254, 22818022, 2282481, H01L 21283, H01L 2148, H01L 2160

Patent

active

056438311

ABSTRACT:
A method for fabricating a semiconductor device using a solder ball forming plate having cavities. The plate is made from a silicon plate having a flat surface in a <110> crystallographic plane, and an orientation flat in a <1-11> crystallographic plane. The cavities are formed on the flat surface of the plate by etching, using a mask having openings in the shape of rhombus arranged such that one side of the rhombus is generally parallel to the <1-11> crystallographic plane. As a result, the cavities having wedge-shaped bottom are formed. The cavities are then filled with a solder paste and are heated to form solder balls in the cavities while the plate in an inclined position. The solder balls are then transferred from the plate to a semiconductor chip.

REFERENCES:
patent: 3458925 (1969-08-01), Napier et al.
patent: 5135606 (1992-08-01), Kato et al.
patent: 5136363 (1992-08-01), Endo et al.
patent: 5145552 (1992-09-01), Yoshizawa et al.
patent: 5208186 (1993-05-01), Mathew
patent: 5381848 (1995-01-01), Trabucco

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